Photoresist Coating Methods for the Integration of Novel 3-D RF Microstructures

This paper presents three coating methods of photoresist on large three-dimensional (3-D) topography surfaces. Two special methods, spray and electrodeposition (ED) are introduced and investigated for the fabrication of 3-D microstructures and RF-MEMS devices. Characteristics of each method as well as its advantage and disadvantages are outlined. A comparison is made to point out the most suitable coating method in terms of complexity, performance and type of application. The potential of these coating methods is demonstrated through several applications such as fabrication of multilevel micromachined structures and RF MEMS devices.