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. Here, the progress of this fast developing area is reviewed, mainly focusing on: 1) material requirements (materials that are able to form efficient thick active layer films for large-area printing); 2) modular designs (effective designs that can suppress electrical, geometric, optical, and additional losses, leading to a reduction in the PCE of the devices, as a consequence of substrate area expansion); and 3) printing methods (various scalable fabrication techniques that are employed for large-area fabrication, including knife coating, slot-die coating, screen printing, inkjet printing, gravure printing, flexographic printing, pad printing, and brush coating). By combining thick-film material systems with efficient modular designs exhibiting low-efficiency losses and employing the right printing methods, the fabrication of large-area OSCs will be successfully realized in the near future.
Wang et al. (Mon,) studied this question.
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