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The Knowles SiSonic TM MEMS microphone has been successfully commercialized for use in cell phones, cameras, PDA's, and other high volume consumer electronics. One advantage that MEMS microphones have over traditional Electret Condenser Microphones (ECMs) is the ability to be reflow soldered. Cost is a significant driver in the design of a MEMS microphone. SiSonic TM uses a non-integrated approach to MEMS and CMOS while minimizing both die sizes. Key to the small MEMS die size is the use of a simply supported freeplate diaphragm. The CMOS die has been optimized to work with very low input capacitance. A low cost package has been developed utilizing laminated FR4 PCB material. The microphones are 100% tested on a high speed automated acoustic test station.
Loeppert et al. (Sun,) studied this question.