What question did this study set out to answer?

To develop an ultra-compact hybrid processor for small form factor mobile devices using 3D die stacking to achieve wide dynamic power-performance scaling.

February 1, 2020

1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm2, 1mm Package-on-Package

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Authors

WGWilfred GomesIntel (United States)SKSanjeev KhushuIntel (United States)DID. IngerlyIntel (United States)

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Implication

Technical report demonstrates a 3D stacked hybrid processor combining 10nm and 22FFL silicon in mobile architectures, highlighting dynamic power-performance scaling for ultra-compact devices.

Key Points

To develop an ultra-compact hybrid processor for small form factor mobile devices using 3D die stacking to achieve wide dynamic power-performance scaling.
Integrated a 10nm+ compute die containing one high-performance Core and four power-efficient Atom cores connected via a cache-coherent fabric.
Stacked the compute die over an Intel 22FFL base chipset die handling I/O and sensor interfaces using low-power Foveros Die Interface (FDI) interconnects.
Packaged the 3D stacked system in a 12×12 mm², 1 mm thick Package-on-Package (PoP) structure integrating 4×16 LPDDR4X memory and PMIC-based power delivery.
Enabled operating systems to dynamically route workloads between asymmetric core types based on performance and energy requirements.
Achieved full integration of CPU, GPU, memory, display engine, PCIe Gen3, USB Type-C, audio, and sensors within a 1mm profile package.

Cite This Study

Gomes et al. (2020) studied this question.

synapsesocial.com/papers/6a0977d159b902245b45cf80 https://doi.org/10.1109/isscc19947.2020.9062957

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Implication

Technical report demonstrates a 3D stacked hybrid processor combining 10nm and 22FFL silicon in mobile architectures, highlighting dynamic power-performance scaling for ultra-compact devices.

1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm2, 1mm Package-on-Package

Discussion

Member takes

Implication

Key Points

Cite This Study

1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm2, 1mm Package-on-Package

Discussion

Member takes

Implication

Key Points

Cite This Study

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