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Self-assembly of three-dimensional microstructures using the surface tension force of molten solder to produce out-of-plane rotation is demonstrated. The generic nature of the technique is illustrated by reconfiguring structures formed in both Ni metal and single crystal Si. The structures do not have a hinge to constrain the rotation. This considerably simplifies fabrication and eliminates problems associated with the compatibility of a suitable hinge material. Details of the fabrication processes are given and results are presented for rotated structures.
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Green et al. (1995) studied this question.
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