A 10.6-30.4 GHz quasi-TEM horn array fully integrated in multilayer PCB for UAV-satellite applications

This paper presents a Quasi-TEM Horn Array (QTHA) implemented through multilayer Printed Circuit Board (PCB) technology, employing a dimension-reduction method to simplify the inherent three-dimensional curved structure. The stack-up PCB is consists of 9-layer circuits, 5 categories of drilling, and bidirectional back-drilling. An 8×8 antenna array with element size of 5.46×5.46×4.124 mm 3 is designed, fabricated, and measured. Simulation and measurement demonstrate that the proposed QTHA achieves a 96.7% impedance bandwidth (10.6-30.4 GHz), while offering the capability to realize a beam steering range of ±40° across 11 to 29 GHz. Additionally, the QTHA exhibits a realized gain of 14.8-23 dBi and an aperture efficiency exceeding 80% across the entire operation band. Furthermore, the QTHA exhibits notable advantages in miniaturization, low profile, low cost, lightweight construction, and high integration density, making it particularly suitable for compact UAV-satellite communication systems.