This wideband, high-gain Antenna-in-Package (AiP) concept for D-band applications, features a wideband Dielectric Resonator Antenna (DRA) housed within an Embedded Surface Mount Short Horn (ESMSH), to enhance its gain. The AiP is placed on a standard 4-layer baseband printed circuit board (PCB). The gain is further improved by forming a multilayer pyramidal horn antenna in the PCB. Using the simple 4-layer baseband PCB to double as an extension to the ESMSH, is a low-cost solution that improves the gain of the AiP with up to 5 dBi. The resultant measured peak gain is 12.7 dBi and the gain is above 9 dBi from 110–170 GHz. The AiP and PCB assembly is low-profile with a height of 0.9λ <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> , and the antenna aperture is only 1.8λ <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> x 1.8λ <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> . Lastly, the reflection coefficient remains below -10 dB within the range of 112 to 169 GHz, corresponding to a relative bandwidth of 41 %.
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Bekker et al. (2024) studied this question.
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