Fiber Bragg Grating Interrogators Based on Photonic Integrated Circuit Platforms

Fiber Bragg Grating (FBG) sensors are widely used for strain and temperature monitoring due to their high sensitivity, compact size, electromagnetic immunity, and multiplexing capability. While conventional FBG interrogators remain bulky and costly, Photonic Integrated Circuit (PIC) platforms provide a promising route toward compact, scalable, and low-power FBG interrogation. However, the choice of architecture strongly determines the achievable resolution, bandwidth, multiplexing capacity, and robustness. This review compares on-chip demodulation architectures, evaluating their performance in resolution, bandwidth, and interrogation speed. We show that the optimal architecture depends strongly on the application: AWG-based schemes excel in compact, multi-FBG readout; ring-resonator systems are highly effective for tunable filtering; and interferometric phase-domain schemes offer the highest sensitivity for dynamic strain sensing. Despite these architectural advances, practical deployment remains constrained by system-level bottlenecks. These challenges primarily include source/detector integration, fiber–chip coupling, packaging robustness, and thermal drift. Overcoming these barriers requires a shift in future development from isolated photonic-device optimization toward comprehensive, system-level co-design.