Improved surface morphology and texture of Ag films on indium tin oxide via Cu additions

The surface and texture properties of Ag(Cu) alloy thin films on indium tin oxide (ITO) has been investigated and compared to pure Ag thin films on ITO. Atomic force microscopy (AFM) and x-ray diffraction results of annealed films show differences in the evolution of surface morphology and texture with annealing. The presence of Cu atoms in the silver alters the alloy’s surface energy and surface diffusion. This results in Ag and Ag(Cu) alloy having the very different surface morphology and crystallographic texture. The (111) texture of the Ag(Cu) is enhanced when compared to that of pure Ag films. The resistivity of Ag(Cu) films annealed at high temperatures (∼up to 600°C for 1h in vacuum) remained constant due to absence of agglomeration.