Demonstrates improved thermal conductivity in aluminum/diamond composite foams, suggesting enhanced cooling efficiency for electronics.
• Non-stochastic Al/diamond composite foams were fabricated via liquid infiltration. • Interfacial engineering controls Al 4 C 3 formation enhancing heat transport. • Thermal conductivity (TC) increases up to 3x compared with pure aluminum foams. • Power dissipation improves by nearly 50% under operational conditions. • High TC and low pressure drop enable energy-efficient electronics cooling.
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Maiorano et al. (2026) studied this question.
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