Self-aligned flip-chip assembly of protonic devices with electrical and optical connections

A technique is discussed which offers major advantages in performance, ruggedness, and cost in the interfacing of integrated optical circuits. The technique is based on a self-aligned flip-chip solder bump bonding process and achieves approximately 1- mu m accuracy in optical fiber placement without requiring micromanipulation of piece parts during final assembly. A high density of electrical interconnections is achieved simultaneously with the optical fiber connections. Material considerations, precision, and reproducibility are discussed.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>