The use of an electromagnetic analysis of 3‐D planar structures is described with respect to the educational requirements of students from the college freshman level through the graduate level. The analysis is intended primarily for microwave use; however, there is also significant potential interest from the student of high speed digital design. The analysis is used for passive planar circuits with any number of layers. The third dimension is represented by vias. A mature graphical user interface is provided allowing rapid capture of structure geometry, color visualization, and animation of the resulting current distributions. The software is also explicitly designed to work in conjunction with popular circuit theory based microwave software and with SPICE.
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James C. Rautio (1993) studied this question.
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