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Temperature distributions from heating in a domestic microwave oven were studied by considering the coupling between the electromagnetics and heat transfer through changes in dielectric properties during heating. Maxwell's equations for electromagnetics and the thermal energy equations are solved numerically using two separate finite-element softwares. The coupling between the softwares was developed by writing special modules that interfaced these softwares at the system level. Experimentally measured temperature profiles were compared with the numerical predictions. The importance of coupling was evident when the properties changed significantly with temperature for low and high dielectric loss materials and more so for the high loss materials. For moderate loss materials, when the properties do not change as much with temperature, coupled solutions lead to results very close to the results for the uncoupled solution.
Zhang et al. (Sat,) studied this question.
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