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The objective of this paper is to demonstrate that a high temperature, operational burn-in of an automotive electronic module can be an effective means of verifying the module reliability prediction and of anticipating its actual field failure experience. This will be accomplished by reviewing the operation and methods used in an actual production system and will include analysis of the burn-in results and the results of the field performance of the product question.
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L. Lee Kent (1987) studied this question.
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