Physical and Mathematical Modeling of Heat Transfer in an Orthotropic Plate under Real Dynamic Thermal Influence

Problems associated with reduced reliability of electronic systems exposed to elevated temperatures highlight the criticality of heat dissipation. Recently, developers have shown great interest in carbon-based composite thermal-conducting materials. The superior performance of these composites is due to their structural and physical properties. This paper examines the analytical modeling of temperature field distribution in a composite plate. The modeling is performed by solving a time-dependent problem for an orthotropic plate subjected to heat flow. The calculation is performed for a carbon-fiber plate.