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In this paper, we present a novel micromachined hot-film flow sensor system realized by a technique using a film depositing processes and incorporating a standard printed circuit. Sensor electrodes and electronic circuits are preprinted on a flexible substrate of polyimide (PI), i.e., a flexible printed circuit board (FPCB). The sensing element, which is made of Cr/Ni/Pt with a temperature coefficient of resistance around 2,000 ppm/K, is fabricated on the FPCB by either magnetron sputtering technology or pulsed laser deposition (PLD). The sensor can be packed efficiently at high-density and integrated with signal processing circuits without additional pads. A simple fabrication process using mature technique and materials selection guarantees that the time and costs are greatly reduced. Both steady-state and transient characteristics of the sensors are experimentally tested, and the results presented to validate the effectiveness of the sensors.
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Liu et al. (2009) studied this question.
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