In the past few years, various 3D NAND Flash memories have been demonstrated, from device feasibility to chip implementation, to overcome scaling challenges in conventional planar NAND Flash [1-3]. The difficulties include shrinking the NAND cell and increasing manufacturing costs due to quadruple patterning and extreme ultraviolet lithography, motivating the development of the next-generation node beyond 16nm-class NAND Flash [4]. In this paper, as a new 3D memory device with lower manufacturing cost and superior device scalability, we present a true 3D 128Gb 2b/cell vertical-NAND (V-NAND) Flash. The chip accomplishes 50MB/s write throughput with 3K endurance for typical embedded applications such as mobile and personal computer. Also, extended endurance of 35K is achieved with 33MB/s of write throughput for data center and enterprise SSD applications.
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Park et al. (2014) studied this question.