A Review on the Additive Manufacturing of W-Cu Composites

In recent years, W-Cu composite systems have become very interesting subjects due to good electrical and thermal conductivity, high-temperature strength, certain plasticity, and excellent radiation resistance. W-Cu composites are a very important class of materials in applications like PFM (plasma facing materials), functional graded materials (FGM), electronic packaging materials, high-voltage electrical contacts, sweating materials, shaped charge liners, electromagnetic gun-rail materials, kinetic energy penetrators, and radiation shielding/protection. There is no possibility of forming a crystalline structure between these two materials. However, due to the unique properties these materials possess, they can be used by preparing them as a composite. Generally, W-Cu composites are prepared via the conventional powder metallurgy routes, i.e., sintering, hot pressing, hot isostatic pressing, isostatic cold pressing, sintering and infiltration, and microwave sintering. However, these processes have certain limitations, like the inability to produce bulk material, they are expensive, and their adoptability is limited. Here, in this review, we will discuss in detail the fabrication routes of additive manufacturing, and its current progress, challenges, trends, and associated properties obtained. We will also explain the challenges for the additive manufacturing of the composite. We will also compare W-Cu composites to other materials that can challenge them in terms of specific applications or service conditions. The solidification mechanism will be explained for W-Cu composites in additive manufacturing. Finally, we will conclude the progress of additive manufacturing of W-Cu composites to date and suggest future recommendations based on the current challenges in additive manufacturing.