Recent Surface Finish Technology Leads Next Gen. Chiplets Era

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Key Points

The aim is to investigate the evolution of surface treatments, focusing on electrode miniaturization in semiconductor packaging.
Examined the development of surface treatment technologies for semiconductor packaging.
Analyzed the roles and structures of final surface treatments in connecting semiconductor chips.
Explored the transition to using barrier metals in nickel-gold structures for improved coating efficiency.
Highlighted the necessity of fine wiring and surface electrode formation in high-density circuits.
Emphasized the use of nickel as a barrier metal in Ni/Au structures to reduce gold thickness to approximately 50 nm.
Discussed the balance between effective coating and cost concerns associated with gold treatments.

Reviews advancements in surface treatments and electrode miniaturization for semiconductor packaging.

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IMAFUJI et al. (2025) studied this question.

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