Demonstrates enhanced thermal conductivity in polymer composites, suggesting new applications in insulation.
Mesophase pitch‐based carbon fibers (MPCFs) are promising thermally conductive fillers but suffer from high electrical conductivity and significant interfacial thermal resistance. We propose a dual strategy combining interfacial covalent bonding with pressure‐induced flow (PIF) orientation to overcome these limitations. A core‐satellite hybrid filler (CF@SiC) was synthesized by covalently grafting SiC onto oxidized MPCFs using a silane molecular bridge, aiming to enhance interfacial phonon transport while insulating the conductive core. Processed into HDPE composites via PIF, the hybrids exhibited high alignment, yielding significant thermal anisotropy. At a 30 wt% loading, the composite achieved a high in‐plane thermal conductivity of 6.83 W·m −1 K −1 . Crucially, the composite maintained an outstanding volume resistivity of 1.81 × 10 15 Ω, outperforming the percolated control composite by five orders of magnitude. This work effectively resolves the conductor‐insulator paradox, offering a versatile strategy for developing directionally thermally conductive yet electrically insulating polymer composites.
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Wu et al. (2026) studied this question.
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