Strategies are presented to achieve ultrathin light-emitting diodes using the technique of epitaxial liftoff in ways that protect the materials from the etchants used for release and tether the devices to the underlying wafer for subsequent transfer printing onto substrates of interest. The results lead to an advanced interconnection scheme and vertical device layout that facilitate electrical contacts and system integration on flexible substrates.
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Kim et al. (2012) studied this question.
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