A raised source/drain (S/D) MOSFET with sidewall spacers formed both before and after selective epitaxial silicon deposition in S/D regions is discussed. The second spacer overlies any faceted regions of the epitaxial silicon near the gate edge and has advantages for MOSFETs with implant-doped or in-situ doped epitaxial silicon regions. In particular, the spacer can prevent S/D dopants from being implanted through any thinner faceted regions near the gate edge, which would otherwise result in a deeper than desired junction depth in the silicon substrate. Additionally, the spacer can prevent source-to-substrate salicide shorts through the thinner faceted regions.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Rödder et al. (1991) studied this question.
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