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Silicon carbide (SiC) is a wide bandgap semiconductor of interest in microelectromechanical systems. We demonstrate the growth of SiC nanoparticles using silicon dioxide films deposited from tetraethylorthosilicate [TEOS, ]. High-temperature annealing allows residual carbon to diffuse to and react with the silicon substrate to form SiC nanoparticles (rather than a uniform SiC film). The growth of the SiC nanoparticles can be controlled by annealing conditions or eliminated by flowing oxygen during the film deposition. These particles are revealed by a standard wet etchant and provide an effective method to reduce adhesion between micromachined surfaces.
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DelRio et al. (2006) studied this question.
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