Shows improved thermal and mechanical properties in silicone rubber composites, suggesting advancements in electronic packaging.
In this study, a simple and environmentally benign method was developed to synthesize expanded graphite‐polydopamine‐copper (EG‐PDA‐Cu) hybrid nanoparticles. The procedure involved first modifying EG via a mussel‐inspired technique to deposit a polydopamine coating, after which Cu 2+ ions were reduced to immobilize copper nanoparticles onto the EG‐PDA substrate. The as‐synthesized EG‐PDA‐Cu nanoparticles were subsequently blended into a silicone rubber matrix (VMQ) to form elastomeric composites. Owing to the synergistic contribution of Cu and EG, the 10 wt% EG‐PDA‐Cu/VMQ composite achieved a thermal conductivity of 1.375 W m −1 K −1 , representing a 7.63‐fold enhancement over pristine VMQ (0.18 W m −1 K −1 ). Furthermore, the composites exhibited outstanding electromechanical and mechanical performance. This approach holds significant potential for fabricating high‐thermal‐conductivity dielectric materials suitable for thermal management in electronic packaging.
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Liu et al. (2026) studied this question.
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