Shows enhanced electrical conductivity in ceramic substrates, suggesting effective fabrication techniques.
Silver conductive structures were fabricated on 96% alumina ceramic substrates by selectively irradiating a silver nitrate precursor liquid film using a 355 nm Nd:YAG nanosecond laser under ambient conditions, without the use of external reducing agents. The effects of laser energy density, scan number, precursor concentration, plasma pretreatment, and PVP-30 addition on the morphology, composition, electrical conductivity, and adhesion of the deposited structures were investigated using XRD, SEM, EDS, contact angle measurements, resistance measurements, and tape-peeling tests. XRD confirmed the formation of metallic Ag in the laser-scanned regions. Insufficient laser energy density led to incomplete Ag+ reduction and discontinuous conductive paths, whereas excessive energy input caused hollow formation and Ag edge accumulation. A laser energy density of 12.03 J/cm2 provided a favorable balance among structural integrity, Ag enrichment, and electrical conductivity. Increasing the scan number promoted particle coalescence and conductive network formation, while 1000 scanning cycles provided a suitable balance between structural continuity and dimensional precision. As the AgNO3 concentration increased, the deposited structures evolved from isolated particles into continuous and compact layers, with 5 mol/L showing favorable deposition performance. Plasma pretreatment combined with PVP-30 addition reduced the contact angle of the ceramic surface from 48.25° to 19.05°, thereby improving the continuity, uniformity, and compactness of the deposits. After the scan spacing was reduced to form continuous silver films, the samples retained more than 98% of their conductivity after five tape-peeling cycles, with a resistivity of 6.14 × 10−8 Ω·m. These results demonstrate that laser-induced deposition is a controllable strategy for fabricating conductive silver structures on ceramic surfaces.
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Zhang et al. (2026) studied this question.
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