(9) Stress Analysis and Thermal Deterioration of Bonded Joints with Inorganic Adhesives

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The study aims to investigate the stress and thermal properties of bonded joints using inorganic adhesives under high temperatures.
Measured the temperature-dependent elastic modulus of various inorganic adhesive bulk samples up to 900°C.
Conducted stress and thermal stress analyses on simple lap adhesive joints under shear loading.
Performed push-out tests to examine the effects of adhesive thickness and substrate material on shear strength.
Maximum stress occurred at the adhesive layer's end near the shaft, increasing with adhesive thickness.
Experimental results showed reduced strength with increased adhesive thickness, aligning qualitatively with stress analysis predictions.
Finite element analysis revealed distributions of mechanical stress and thermal stress under high-temperature conditions.

Analyzes the shear strength of inorganic adhesive joints under high temperatures, indicating the importance of adhesive thickness.

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MORI et al. (2024) studied this question.

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