(12) Modeling Adhesion Analysis Using Contemporary General-Purpose FEM

The Japanese industry has turned the extended timelines required for materials development into an advantage, establishing close coordination within its value chain and showcasing its exceptional niche-leading products to the world. However, in light of current challenges, it has become increasingly difficult to remain competitive as a niche player alone. This is because reducing environmental impact through weight reduction necessitates the development of complex and comprehensive materials-so-called multi-materials. Adhesive technology, without question, plays a crucial role in this context. In recent years, a methodology known as the “digital twin” has been proposed. The digital twin enhances problem-solving capabilities by creating a twin structure of the physical and cyber worlds in an advanced digital space（DX）, allowing for mutual feedback between physical measurements and cyber analyses. This paper presents a case study in which a challenging adhesive problem was analyzed using digital twin techniques, employing the functions of general-purpose FE software.