A hybrid encapsulation method for organic electronics

We report a thin-film encapsulation method for organic electronics that combines the deposition of a layer of SiOx or SiNx (100 nm) by plasma enhanced chemical vapor deposition followed by a layer of Al2O3 (10–50 nm) by atomic layer deposition and a 1-μm-thick layer of parylene by chemical vapor deposition. The effective water vapor transmission rates of the encapsulation was (2±1)×10−5 g/m2 day at 20 °C and 50% relative humidity (RH). The encapsulation was integrated with pentacene/C60 solar cells, which showed no decrease in conversion efficiency after 5800 h of exposure to air demonstrating the effectiveness of the encapsulation methodology.