Topology Optimization of MIMO Cooling Plates for Discrete Heat Sources in GPUs

With the rising integration of high-performance GPUs, localized hotspots induced by discrete heat sources present severe thermal challenges. Traditional single-inlet–single-outlet liquid cold plates can scarcely meet the heat dissipation requirements of inhomogeneous high heat fluxes. This study systematically investigates the effects of nine multiple-inlet–multiple-outlet (MIMO) configurations, ranging from single-inlet–single-outlet to three-inlet–three-outlet, on cold plate hydrothermal performance. An innovative stepwise optimization strategy, topology optimization (TO)-driven channel layout combined with fin-enhancement (FE)-based fine regulation, is proposed and verified to precisely regulate surface temperature distribution of discrete heat sources. The results show that the three-inlet–three-outlet configuration C-3 exhibits the optimal comprehensive performance among the nine configurations. Compared with the worst configuration A-2, C-3 reduces the pressure drop by 58.37% to only 147.18 Pa and yields the highest PEC, striking the optimum trade-off between heat transfer enhancement and fluid flow resistance. Through multi-inlet flow distribution and multi-outlet heat extraction, C-3 accurately suppresses heat accumulation in high heat flux regions, limiting the maximum temperature to merely 29.82 °C and drastically narrowing the substrate temperature difference from 8.69 °C to 2.12 °C. In comparison with the traditional cold plate (TCP), the optimized cold plate (OCP) realizes a 17.42% increase in performance evaluation criterion (PEC). Furthermore, the fin-enhanced optimized cold plate (FEOCP) reduces the temperature standard deviation by 54.15% relative to TCP, significantly enhancing temperature uniformity with only an additional pressure drop penalty of 5.43%. This study reveals the regulation mechanism of MIMO configurations on the flow field distribution of liquid cold plates and verifies the effectiveness of the TO-FE optimization framework, thus providing highly valuable engineering solutions for the high-efficiency, uniform-temperature and low-resistance heat dissipation of high-power electronic devices.