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Tree-shaped Nanosheet FETS (NSFET) is the most dependable way to scale down the gate lengths deep. This paper investigates the 12nm gate length (L G ) n-type Tree-shaped NSFET with the gate having a stack of high- k dielectric (HfO 2 ) and SiO 2 using different spacer materials, which can be done using TCAD simulations. The Tree-shaped NFET device with T (NS) = 5 nm, W (NS) = 25 nm, W IB = 5 nm, and H IB = 25 nm has high on-current ( ION ) and low off-current ( IOFF ). The 3D device with single- k and dual- k spacers are compared and its DC characteristics are shown. It is noted that the dual- k device achieves the maximum ION / IOFF ratio, which is 10 9 , compared to 10 7 because the fringing fields with spacer dielectric lengthen the effective gate length. Additionally, the impact of work function, interbridge height, width, gate lengths, and temperature, along with the device’s analog/RF and DC metrics, is also investigated in this paper. Even at 12 nm L G , the proposed device exhibits good electrical properties with DIBL = 23 mV/V and SS = 62 mV/dec and switching ratio ( ION / IOFF ) = 10 9 . The device’s performance confirms that Moore’s law holds even for lower technology nodes, allowing for further scalability.
Gowthami et al. (Mon,) studied this question.