Dynamic multi-band electromagnetic manipulation improves signal integrity in advanced device designs.
Dynamic multi‐band electromagnetic manipulation is essential for advanced intelligent perception and information integration. However, existing technologies are difficult to suppress signal crosstalk between different frequency ranges. Herein, we report a dynamic VO 2 /SiO 2 /VO 2 sandwich architecture that overcomes cross‐band coupling by optimizing Fabry‐Pérot resonance via thickness‐induced symmetry breaking, strategically leveraging frequency‐dependent skin depth disparity for synergistic control. Specifically, three operational types are realized by precisely engineering the structural symmetry‐breaking degree. The infrared‐selective modulation type utilizes substantial thickness asymmetry to decouple resonance modes, featuring wide‐range infrared (IR) emissivity modulation (0.28–0.82) in 8–14 µm with minimal microwave response. The microwave‐selective modulation type similarly exploits structural asymmetry to enable efficient modulation of both microwave absorption efficiency (0.66) and electromagnetic shielding effectiveness of 19.1 dB in X and Ku bands while maintaining negligible IR tunability. Finally, by reducing the thickness contrast to partially restore structural symmetry and enhance mode coupling, the dual‐band synergistic modulation type, simultaneously delivers high‐amplitude IR emissivity variation (0.54) and a microwave shielding effectiveness variation of 27.8 dB. This work reveals the fundamental role of symmetry modulation in governing the transition from decoupling to coupling performance, offering a universal design paradigm for next‐generation integrated device development.
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Zhao et al. (2026) studied this question.
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