Evaluates the impact of low-pressure plasma on bond strength in PEEK surfaces, indicating promising improvements.
Purpose: The use of computer-aided design and computer-aided manufacturing (CAD-CAM) systems has increased the need for reliable metal-free restorative materials. Poly (etheretherketone) (PEEK) shows excellent physical and mechanical properties, but its bonding protocols remain insufficiently established. Various surface treatments have been proposed to improve adhesion. This study investigated the effect of low-pressure plasma treatment on PEEK surfaces and evaluated the bond strength of a methyl methacrylate (MMA)-based adhesive applied to plasma-treated PEEK.
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ITO et al. (2026) studied this question.
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