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Self-assembled monolayer (SAM) of 1-hexanethiol is applied on copper (Cu) surface to retard surface oxidation during exposure in the ambient. This SAM layer can be desorbed effectively with an annealing step in inert N2 ambient to provide a clean Cu surface. Using this passivation method with SAM, wafers covered with thin Cu layer are passivated, stored, desorbed, and bonded at 250 °C. The bonded Cu layer presents clear evidence of substantial interdiffusion and grain growth despite prolonged exposure in the ambient. This method of passivation is proven to be effective and can be further optimized to enable high quality Cu–Cu direct bonding at low temperature for application in three-dimensional integration.
Tan et al. (Mon,) studied this question.