Reprocessable Disulfide‐Based Vitrimers with Adhesive Properties

A family of disulfide (S-S) containing thiol-vinyl-epoxy dynamic networks are presented. The networks are obtained through a dual-curing mechanism wherein a photoinduced thiol-ene reaction at room temperature is followed by a thermally activated, tertiary amine catalyzed thiol-epoxy curing stage, enabling controlled network development. Cured materials show reprocessability thanks to heat-triggered disulfide bond exchange. The influence of catalyst structure on curing behavior, thermomechanical properties, stress relaxation, and this reprocessability is systematically investigated. These solvent-free materials with a unique ternary composition exhibit efficient network rearrangement and successful thermal reprocessing, demonstrating their potential as sustainable materials.