Evaluates thermal stability of hybrid polyimide in aerospace applications, suggesting improved performance.
Polyimides (PIs) are high‐performance polymers owing to their excellent thermal stability, mechanical strength, and chemical resistance, etc. However, PIs often exhibit limitations in thermal performance and processability at high temperatures for aerospace application. In this study, organic–inorganic hybrid PI oligomers were synthesized via chemical imidization to enhance their thermal stability. Amino‐functionalized polyhedral oligomeric silsesquioxane (NH 2 ‐POSS) was incorporated into the PI backbone at various concentrations, which contributed to the formation of strong interfacial interactions, resulting in a stable hybrid structure. The incorporation of POSS in crosslinked PI significantly increased thermal stability, such as glass transition temperature ( T g ) and thermal decomposition temperatures ( T d,5wt% ). SEM images showed a more homogeneous morphology, indicating good compatibility between organic and inorganic phases. These findings demonstrate that NH 2 ‐POSS is an effective dispersant for improving the performance of crosslinked PI, making it a promising candidate for advanced applications in electronics, aerospace, and high‐temperature environments.
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Yoon et al. (2026) studied this question.
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