Shows enhanced breakdown strength and energy density in dielectric films, indicating potential for microelectronics.
High-temperature dielectric films hold broad prospects in next-generation microelectronics and power systems. However, commercially available dielectric materials for electrostatic energy storage, specifically biaxially oriented polypropylene, suffer from drawbacks such as low energy density, low efficiency, and poor reliability, which limit the application of film capacitors in harsh environments. Herein, a series of naphthalene tetracarboxylic acid dianhydrides were incorporated into polyetherimide (PEI) backbone, thereby modulating the charge transport behavior. Specifically, synergistic regulation of traps and dihedral angles has effectively enhanced the breakdown strength of PEI. At 200 °C, the optimized dielectric film delivers a discharged energy density of 6.00 J cm−3 at an efficiency of 90%, and maintains stable performance over 105 charge-discharge cycles at 300 MV m−1. Multilayer stacked film capacitors prepared from the optimized films exhibit remarkable thermal stability and capacitive performance. This work proposes a feasible strategy for developing dielectric films with remarkable energy storage performance, superior thermal stability, and scalable fabrication capability. High-temperature dielectric films are promising for next-generation microelectronics and power systems. Here the authors incorporated naphthalene tetracarboxylic acid dianhydrides into polyetherimide to regulate charge transport behavior and effectively improved the breakdown strength via synergistic modulation of traps and dihedral angles.
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Zhao et al. (2026) studied this question.
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