Investigation of the processing dependence of SL solidification residual stresses

This paper presents an experimental study undertaken to determine the polymerisation‐induced residual stresses generated in stereolithography (SL) built test specimens, by using the hole‐drilling strain gage method of stress relaxation. Experimentally measured strains, using special three‐element strain gage rosettes, were input into the blind‐hole analysis to calculate the induced residual stresses. The mechanical properties of resin specimens fabricated by the solidification process using an epoxy based photopolymer and post‐cured under ultraviolet (UV) and thermal exposure were determined and incorporated into the subsequent drill‐hole analysis. The effect of the pre‐selected fabrication parameters (hatching space and curing depth) and subsequent by the post‐curing procedure (UV, thermal curing) on the magnitude of the recorded strains is also presented.