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Additive manufacturing technologies are no longer limited to rapid prototyping but are increasingly used for low-volume production of functional end-use components. Among advanced AM techniques, HP Multi-Jet Fusion (MJF) stands out for its high precision and efficiency. Polyamides, thanks to their balanced mechanical and thermal properties, are commonly used as building materials in this technology. However, these materials are notoriously difficult to bond with conventional adhesives. This study investigates the shear strength of bonded joints made from two frequently used MJF materials—PA12 and glass-bead-filled PA12—using four different industrial adhesives. Experimental procedures were conducted according to ASTM standards. Specimens for single-lap-shear tests were fabricated on an HP MJF 4200 series printer, bonded using a custom jig, and tested on a Zwick-Roell Z250 electro-mechanical testing machine. Surface roughness of the adherends was measured with a 3D optical microscope to assess its influence on bonding performance. The polyurethane-based adhesive (3M Scotch-Weld DP620NS) demonstrated superior performance with maximum shear strengths of 5.0 ± 0.35 MPa for PA12 and 4.4 ± 0.03 MPa for PA12GB, representing 30% and 17% higher strength, respectively, compared to epoxy-based alternatives. The hybrid cyanoacrylate–epoxy adhesive (Loctite HY4090) was the only system showing improved performance with glass-bead-reinforced substrate (16.5% increase from PA12 to PA12GB). Statistical analysis confirmed significant differences between adhesive types (F3,24 = 31.37, p < 0.001), with adhesive selection accounting for 65.7% of total performance variance. In addition to the experimental work, a finite element-based numerical simulation was performed to analyze the distribution of shear and peel stresses across the adhesive layer using Siemens Simcenter 3D 2406 software with the NX Nastran solver. The numerical results were compared with analytical predictions from the Volkersen and Goland–Reissner models.
Sedláček et al. (Thu,) studied this question.