Formation mechanism and electrochemical behavior of porous copper electrodes prepared by particle electrodeposition

Porous copper (Cu) electrodes were fabricated via electrodeposition using Cu particle dispersions containing various concentrations of sodium dodecyl sulfate (SDS). Increasing SDS concentration reduced surface tension, resulting in smaller pore sizes. A formation mechanism was proposed, in which hydrogen bubble generation and Cu particle deposition compete to determine the porous structure. Post-treatment induced Cu sintering, improving mechanical strength without altering pore size. Electrochemical measurements revealed enhanced hydrogen evolution and Cu redox currents, with the highest activity observed for electrodes deposited for 15 min. These findings demonstrate a simple strategy to control Cu electrode microstructure for improved electrochemical performance.