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Normally off Al 2 O 3 /GaN MOSFETs are fabricated by utilizing a simple tetramethylammonium hydroxide (TMAH) treatment as a postgate-recess process. The TMAH-treated device with a gate length of 2.5 μm exhibited excellent device performances, such as a threshold voltage of 3.5 V, a maximum drain current of 336 mA/mm, and a breakdown voltage of 725 V, along with extremely small gate leakage current of about 10 -9 A/mm at V gs = 15 V, which is approximately six orders lower in magnitude compared to that of the device without TMAH treatment.
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Kim et al. (2011) studied this question.
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