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A new technique is presented for separating the threshold-voltage shift of an MOS transistor into shifts due to interface states and trapped-oxide charge. Using this technique, the radiation responses of MOS capacitors and transistors fabricated on the same wafer are compared. A good correlation is observed between p-substrate capacitors and n-channel transistors irradiated at 10 V, as well as between n-substrate capacitors and p-channel transistors irradiated at 0 V. These correlations were verified for samples having large variations in the amount of radiation-induced trapped holes and interface states. An excellent correlation is also observed between n-channel capacitors and n-substrate transistors irradiated under positive bias. The use of capacitors separately fabricated on control wafers for potential use in process development or monitoring is clearly demonstrated.
Winokur et al. (Sun,) studied this question.