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Abstract A new thermal conduction model is proposed for filled polymer with particles, and predicted values by the new model are compared with experimental data. The model is fundamentally based on a generalization of parallel and series conduction models of composite, and further modified in taking into account that a random dispersion system is isotropic in thermal conduction. The following equation is derived from the new model; log λ = V · C 2 · log λ 2 + (1 − V ) · log( C 1 · λ 1 ). Therefore, when thermal conductivities of polymer and particles (λ 1 , λ 2 ) are known, thermal conductivity of the filled polymer (λ) can be estimated by the equation, with any volume content of particles ( V ). The new model was proved by experimental data for filled polyethylene, polystyrene and polyamide with graphite, copper, or Al 2 O 3 .
Agari et al. (Thu,) studied this question.