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Abstract The rise of miniaturized, integrated, and functional electronic devices has intensified the need for heat dissipation. To address this challenge, it is necessary to develop novel thermally conductive polymer composites as packaging materials. In this paper, a number of factors for the construction and design of thermally conductive polymers are concluded. Special attention is focused on the analysis and comparison of the thermally conductive composites prepared by various fillers or strategies to provide guidelines and references for future design of composite materials. The current commonly used preparation strategies of thermally conductive polymer are summarized, such as using a variety of fillers, vacuum filtration, template method, and so on. The challenges of thermally conductive polymer composites are finally sketched. This review can inspire the design of polymer composites with brilliant thermal conductivity.
Meng et al. (Fri,) studied this question.