Explores device performance in photonic-electronic integration, suggesting effective bonding strategies.
By co-integrating optics and electronics on the same chip, high-functionality, high-performance and highly integrated devices can be fabricated with a well-mastered microelectronics fabrication process. Different integration schemes with bonding are presented either with die-to-wafer or wafer to wafer bonding. Depending of the applications and the maturity level of the technologies, the strategies for integration will differ.
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Fédéli et al. (2014) studied this question.
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