In this paper, the transient electrical-thermal co-simulation is implemented with the finite-element method. The capability of the co-simulation is extended to solve large-scale problems by incorporating a domain decomposition scheme called the finite element tearing and interconnecting (FETI). With the high parallel efficiency of FETI for computing with multiple processors, a significant reduction in computation time is achieved. The transient electrical-thermal behaviors of largescale power distribution networks (PDNs), including on-chip power grids, solder bump arrays, and TSV-based PDN are simulated and analyzed with the proposed method. The impacts on the design of the PDNs from different types of input pulses, power maps, and via pitches are also investigated.
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Lu et al. (2014) studied this question.
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