Mechanism and Process Optimization of Pulsed Laser Cleaning of Ink Layers on Ceramic Tiles

Efficient laser cleaning of glazed ceramic tiles requires the ink layer to be removed without damaging the brittle glaze. We investigated the removal of acrylic ink using a 1064 nm, 10 ns Nd:YAG laser operating at 1 Hz. The lens-to-sample working distance L, pulse energy, and pulse number were varied, and the cleaned regions were evaluated by optical microscopy (OM), scanning electron microscopy and energy-dispersive X-ray spectroscopy (SEM–EDS), theoretical analysis, and COMSOL simulation. At L = 20 cm, the sample was close to the nominal focal plane, and the high local fluence removed the ink rapidly, but it also produced whitening, depressions, micro-pits, and glaze damage. Increasing L to 25–30 cm enlarged the measured spot diameter, lowered the average fluence, and widened the controllable cleaning range. Two low-damage conditions were identified at L = 30 cm: 30.80 J/cm2 with 3 pulses and 41.00 J/cm2 with 2 pulses. SEM–EDS showed that cleaning quality cannot be judged from exposed area or carbon content alone; morphology, preservation of the native glaze microstructure, the C/O ratio, and recovery of substrate-related elements must be considered together. Under the stated model assumptions, the calculated local temperature exceeded the acrylic decomposition temperature, and the thermoelastic stress reached tens to hundreds of MPa. These results make thermal decomposition and stress-assisted interfacial separation physically plausible. However, the present data do not separate thermoelastic stress from pressure-wave loading. Likewise, visible air breakdown and non-monotonic cleaning at high pulse energy only suggest possible plasma-related attenuation because plasma density and transmitted laser energy were not measured. The reported combinations should therefore be regarded as a system-specific process window rather than a universal optimum.