Fabrication of Siloxane Hybrid Material With High Adhesion and High Refractive Index for Light Emitting Diodes (LEDs) Encapsulation

A novel inorganic-organic siloxane hybrid material with self-adhesion ability and high refractive index for high-power light emitting diodes (LEDs) encapsulation is introduced. Under the catalysis of an anion exchange resin, the hybrid material was synthesized by a sol-gel condensation process from methacryloxy propyl trimethoxyl silane (MPTS), γ-(2, 3-epoxypropoxy)propytrimethoxysilane (EPTS) and diphenylsilanediol (DPSD). This hybrid material was characterized by Fourier-transform infrared spectroscopy and 1H-NMR. The resin-type encapsulation material was then prepared by hydrosilylation of the newly synthesized inorganic-organic siloxane hybrid material and methylphenyl hydrogen-containing silicone resin. The cured silicone resin-type encapsulation material can be used as a LEDs encapsulant, owing to high refractive index (n = 1.544), high transparency, appropriate hardness, and excellent thermal stability, as well as good adhesive strength between the encapsulating material and the substrate of LED lead frame.