Machining tools based on the excimer laser and x-ray lithography to make ultra-fine machining tool/molds are described in this paper. The lower high-aspect ratio resist molds are fabricated using the KrF excimer laser. The higher aspect-ratio resist molds are made using x-ray lithography. Both low and high aspect-ratio resist molds are then converted into metallic structures using electroforming. The NiCo/SiC microcomposite electroforming with low internal stress (~0 kg mm -2 ) and high hardness (>Hv500) shows its feasibility as mold materials. An example of 2 mm thick integrated circuit (IC) packaging leadframe patterns using x-ray micromachining is illustrated to prove its feasible application. On the technical side, micro-structures with a high aspect ratio of 30 were developed using a graphite membrane based x-ray mask.
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Yang et al. (2001) studied this question.
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