Experimental investigation demonstrates temperature-dependent carrier capture cross sections of gold in silicon, indicating distinct recombination pathways via donor and acceptor levels.
The presence of gold atoms in the silicon lattice decreases the lifetime of excess electrons and holes in p- and n-type material. The capture of electrons in p-type silicon occurs through the gold donor level with a capture cross section, σₙ₀, of 3.5×{}10^-15 cm² (at 300^∘{}K). This capture cross section varies as T^-2.5 between 200^∘{} and 500^∘{}K. In n-type silicon the electron capture cross section, σₙ₀, is 5×{}10^-16 cm² at 300^∘{}K and is temperature independent; the hole capture cross section, σₚ₀, is 1×{}10^-15 cm² at 300^∘{}K and varies as T^-4. The capture in this case occurs through the gold acceptor level.
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G. Bemski (1958) studied this question.
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