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Plasmas have been widely utilized to pattern various materials, from metals to semiconductors and oxides to polymers, for a vast array of applications. The interplay between physical, chemical and material properties that comprises the backbone of plasma etching is discussed in this perspective paper, with a focus on the needed tools and approaches to address the challenges facing plasma etching and to realize the desired pattern transfer fidelity at the nanoscale.
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Marchack et al. (2011) studied this question.
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